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Keynote Presentation

Full Agenda

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TechBlick

Khasha Ghaffarzadeh

Welcome & Introduction

9:15 AM

TRACK 1
Inkatronic
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Inkatronic

9.00AM

Jetting Functional Fluids - Up Scaling from Laboratory to Industrial Production

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 Georg Boedler

Georg Boedler

Inkatronic has over 25 years’ experience in inkjet technologies, and develops specialised industrial machines for mass production. Implementing an inkjet solution to industrial processes can create incredible advantages, as well as open up new opportunities for manufacturing. However, scaling up a solution from a proven laboratory method to a mass-manufacturing environment is surprisingly difficult. In our presentation, we will give a breakdown of some of the challenges that need to be overcome in order to achieve this successfully.

Jetting Functional Fluids - Up Scaling from Laboratory to Industrial Production

9.00AM

Heraeus
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Heraeus

9.20AM

Redefining Coatings in Electronic Packaging: Turnkey Digital Production Process for Selective Metallic Coating

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Franz Vollman

Franz Vollman

Lets reshape the future of Selective Metallic Coatings. Inkjet printing of 2.5D selective coatings becomes reality with our novel solution consisting of a special particle-free silver ink, an industrial hi-tech printer for mass production and a manufacturing process that translates any standard CAD format of a coating drawing into accurate selectively coated components. Our system adds a new dimension to package design, empowering package designers to create varied pattern layouts efficiently. Customized thin metallization films are possible in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver.

The equipment fulfills the standards of the semiconductor industry, and its mass production capability is proven. This additive manufacturing method is especially suited for EMI shielding of semiconductor packages to secure signal integrity in 5G applications. Digital printing via inkjet enhances the design freedom thanks to maskless selective coating of package topsides, sidewalls (e.g. with stand-off), as well as trenches for compartmental shielding. Shielding effectiveness studies run at a specialized renowned institute confirm that the applied silver film with 2 μm thickness, which is inkjet-coated at the ideal, material saving aspect ratio of 1:1 (side wall to top side), provides excellent shielding performance.

The maskless selective and precise deposition of the silver ink onto specific areas of the components avoids excess material and minimizes waste. No wet chemical processes are required, making this process environmentally friendly. With a factor 10 lower power consumption compared to sputtering, it has a much better CO2 balance, too.

Redefining Coatings in Electronic Packaging: Turnkey Digital Production Process for Selective Metallic Coating

9.20AM

nScrypt
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nScrypt

9.40AM

3D Printed Electronics is Powerful when combined with CHIPS

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Kenneth Church

Kenneth Church

The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding.
3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D Printed Electronics and semiconductor chips are a natural marriage.
In this talk we will explore the advantages of 3D Printed Electronics and the required tools to make complete working circuits. Additionally, we will show why successful 3D Manufacturing using 3D Printed Electronics is more than printing. We will demonstrate the advantages of using 3D manufacturing and multiple tools and processes in a single system. The idea of printing structures, conductors and adding actives opens new opportunities for more electronic functions in smaller form factors. It also allows for more personalized electronics to be viable. We will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time.

3D Printed Electronics is Powerful when combined with CHIPS

9.40AM

XTPL
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XTPL

10.00AM

Solution for printed micro-electronics. Next generation of resolution in additive technology.

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 Łukasz Kosior

Łukasz Kosior

XTPL provides additive manufacturing technology and conductive materials at the micron scale to address complex issues in the advanced electronics industry. The company has developed its own solutions that allow for extremely accurate printing of functional features at the micron level with high resolution. This capability extends to both planar and non-planar complex substrates, including the ability to print continuous and highly conductive interconnections oversteps.

In our presentation, we will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications. Additionally, we will present our plans to introduce Ultra-Precise Deposition technology to the industry.

Solution for printed micro-electronics. Next generation of resolution in additive technology.

10.00AM

ioTech Group
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ioTech Group

10.20AM

C.L.A.D. - Continuous Laser-Assisted Deposition of Standard Materials
Manufacturing Sustainability, Flexibility and Product Miniaturisation

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Hervé Javice

Hervé Javice

IoTech is introducing a new and patented digital additive manufacturing technology: the Continuous Laser-Assisted Deposition or CLAD. CLAD is a breakthrough multi-material production process for electronics, from semiconductor packaging to flexible electronics.

CLAD enables the fast, precise, high-resolution, and high-volume deposition of most industrial materials, no reformulation required. Manufacturers can

- use their standard industrial materials,
- control the deposition of every single drop,
- print at up to 30µm resolution and,
- reach unmatched production yields.

The system is fast, contactless, high-resolution and micron-accurate. It enhances manufacturing flexibility for advanced electronic designs. CLAD enables more compact, powerful product functionalities in a wide range of applications. It is compatible with most conductive and dielectric fluids, even of high viscosity.

CLAD is also ESG-compliant and labour-efficient. It provides an alternative to highly polluting subtractive technologies, enabling the re-shoring of production processes to OECD countries

C.L.A.D. - Continuous Laser-Assisted Deposition of Standard Materials
Manufacturing Sustainability, Flexibility and Product Miniaturisation

10.20AM

Exhibition Networking Event
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Exhibition Networking Event

10.40AM

Coffee & Exhibition

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Coffee & Exhibition

10.40AM

Electroninks
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Electroninks

11.30AM

MOD Inks for Additive Manufacturing

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Sima Hannani

Sima Hannani

MOD Inks for Additive Manufacturing

11.30AM

IDS
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IDS

11.50AM

Ultraprecision Aerosol Deposition: Applications in 3D Printing and Packaging

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Dov Henry

Dov Henry

Ultraprecision Aerosol Deposition: Applications in 3D Printing and Packaging

11.50AM

Printed Electronics Ltd
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Printed Electronics Ltd

12.10PM

Increasing the productivity of micron-scale printing with Superfine Inkjet (SIJ) and other tools.

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Neil Chilton

Neil Chilton

PEL is both an experienced manufacturer and specialist machine supplier for printable electronics. At TechBlick we present together with our key partner SIJ. In this presentation we will explain where we have used our knowledge to determine the optimal print methods for applications ranging from large area to ultra-fine-line printing. We will focus on new developments in SIJ including the high productivity multi-nozzle systems.

Increasing the productivity of micron-scale printing with Superfine Inkjet (SIJ) and other tools.

12.10PM

Neotech AMT
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Neotech AMT

12.30PM

Advances in 3D Printed Electronics

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Martin Hedges

Martin Hedges

This presentation will review recent advances in manufacturing sustainable 3D mechatronic systems using Additive Manufacturing (AM) technologies. A brief update of select key industrial applications in Luminaires, Medical and Signal Electronics will be given.

Advances in 3D Printed Electronics

12.30PM

Brewer Science
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Brewer Science

12.50PM

Printed Electronics for Air and Water Quality Measurements

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Adam Scotch

Adam Scotch

Brewer Science's vision is to design, build, and deploy connected gas and water sensors that monitor environmental contaminants quantitatively on a large scale. For the last 10 years, Brewer Science has developed the technology to print cost-effective sensors that can measure contaminants in water, such as heavy metals (lead, cadmium), copper, nitrate, pH, and ORP, as well as sensors that assess air quality by measuring gases like carbon monoxide, carbon dioxide, hydrogen, VOCs, and oxygen. Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, and high-speed jet dispensing. Producing low-cost sensors with low-power electronics and wireless communication will enable the deployment of sensors over vast areas for real-time monitoring of environmental conditions.

Printed Electronics for Air and Water Quality Measurements

12.50PM

Lunch & Exhibition
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Lunch & Exhibition

1.10PM

Lunch & Exhibition

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Lunch & Exhibition

1.10PM

Printed Energy
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Printed Energy

2.50PM

Printed batteries, any shape, everywhere

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Harsha Kolli

Harsha Kolli

Printed Energy, early-stage US based hard science company with deep expertise in electro chemistry, printed electronics, and manufacturing automation. The current focus is on flexible, printed, and thin batteries integrated into fully built-up circuits for a complete device such as active RFID. These batteries are non-toxic, environmentally friendly and can be manufactured in any shape and size based on customer requirements. Some of the applications include, smart tags and labels, wearables, medical supplies, tags for timed sporting events, and many other internet of things (IoT) uses. Even though Printed Energy is starting to enter the market, the team has been working on development of thin printed batteries for many years. The unique value that Printed Energy brings to its customer is the ability to manufacture fully integrated device that is cost competitive with coin-cell battery devices. Our proprietary manufacturing line allows us to enter the market and deliver high quality devices at a highly competitive price. Printed Energy’s initial product offering includes delivering disposable Active RFID tag solutions to an existing market with roadmap that includes Semi-Passive tags, temperature loggers and wearable cosmetic/medical patches.

Printed batteries, any shape, everywhere

2.50PM

Solliance/TNO at Holst
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Solliance/TNO at Holst

3.10PM

Towards Roll-to-Roll Manufacturing of Flexible Perovskite Solar Cells

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Ilker Dogan

Ilker Dogan

The scalable slot-die coating methods adopted within TNO enable fabrication of efficient perovskite solar devices with intrinsic stability using various material and layer combinations. Furthermore, several different encapsulation strategies are investigated to define a low-cost route to guarantee long term stable modules. Demonstration of a stable semi-transparent bifacial flexible perovskite module is a step forward on various applications, such as building- and vehicle-integrated PV (BIPV & VIPV) and noise barriers on highways. In this talk, we will give an overview of our story towards realizing a stable, efficient, and bifacial perovskite processed via roll-to-roll slot-die coating technique.

Towards Roll-to-Roll Manufacturing of Flexible Perovskite Solar Cells

3.10PM

Imprint Energy
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Imprint Energy

3.30PM

Ultrasafe Printed Batteries for Smart Electronics

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Ehsan Faegh

Ehsan Faegh

The rapid growth of smart electronics and internet-connected devices has spurred the demand for compact, flexible and energy-efficient power sources. Printed batteries have emerged as highly promising alternatives to traditional bulky batteries, such as AA or AAA, offering a distinctive solution by seamlessly integrating energy storage directly into electronic components and systems.

In recent years, lithium-ion batteries have dominated the market, however, the lithium-based batteries face several challenges, including lammability, toxicity and disposability concerns, and regulatory challenges related to shipping. Given the importance of safety in smart electronics applications, the adoption of environmentally friendly battery chemistries becomes paramount.

Imprint Energy has pioneered an ultrathin and flexible Zinc battery technology designed to meet the demanding power requirements of cellular applications across a wide range of operating temperatures, from -35°C to 60°C. Our innovative battery solution boasts a remarkable peak power of >1500 mW in a small form-factor.

Compared to lithium chemistries, Imprint Energy batteries excel in multiple performance aspects. A significant advantage of Imprint Energy zinc batteries is their non-hazardous classification, eliminating transport and operational limitations associated with hazardous goods like batteries containing lithium. This makes Zinc batteries particularly appealing for powering smart shipping labels, where safe and unrestricted transportation is essential.

Imprint Energy employs a cutting-edge manufacturing process utilizing screen and stencil printing technologies. The high-throughput sheet and roll-to-roll process ensures efficient and scalable production, enabling widespread adoption.

Herein, we present emerging applications where printed batteries can revolutionize smart electronics. These applications span across wearable devices, Internet of Things (IoT) sensors, flexible displays, electronic textiles, and medical devices and patches. We discuss the advantages offered by printed batteries produced at Imprint Energy in terms of safety, size, shape, weight, flexibility and seamless integration, which enable the development of innovative and user-friendly smart electronic products.

Ultrasafe Printed Batteries for Smart Electronics

3.30PM

Ensurge
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Ensurge

3.50PM

Manufacturing Scale-Up of mAh Class Anode-less Solid-State Lithium Microbatteries

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Arvind Kamath

Arvind Kamath

Rechargeable anode-less solid-state lithium microbattery technology has numerous advantages over conventional alternatives. These include higher volumetric energy density (VED), significantly faster charging with a simpler charging infrastructure and the ability to deliver higher discharge pulses than Li-ion alternatives. These flexible form factor, multi-layer stacked batteries built on stainless steel are key to enabling space constrained wearables, hearables and IoT applications. Addressing the difficult challenges of manufacturing scale-up on the path to commercialization requires addressing a number of challenges ranging from materials supply chain and roll-to-roll battery fabrication management to high-speed test and novel ultrathin packaging. Some examples of these coupled with battery performance will be presented.

Manufacturing Scale-Up of mAh Class Anode-less Solid-State Lithium Microbatteries

3.50PM

Exhibition Networking Event
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Exhibition Networking Event

4.10PM

Coffee & Exhibition Closes

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Coffee & Exhibition Closes

4.10PM

Beko
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Beko

4:30 PM

Can additive electronics help in the white goods industry

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Graham Anderson

Graham Anderson

Can additive electronics help in the white goods industry

4:30 PM

Airbus
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Airbus

4.40PM

The Printed Future At Airbus

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Dennis Hahn

Dennis Hahn

Presentation of an animated movie of our end-to-end vision on how we imagine the printed electronics technology may impact the aviation industry. Introducing our current status of technology testing (hopefully with some breathtaking photos) and open topics such as customization software, max automation and end of life processes. Q&A.

The Printed Future At Airbus

4.40PM

TechBlick
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TechBlick

5:00 PM

Thank you and see you again next year!

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Khasha Ghaffarzadeh

Khasha Ghaffarzadeh

Thank you and see you again next year!

5:00 PM

TRACK 2
TNO at Holst
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TNO at Holst

9.00AM

Laser-Assisted High-throughput microLED Integration

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Gari Arutinov

Gari Arutinov

.With the growing demand for ever-smaller devices, such as mini- and microLED displays with higher resolution rates, there is an unstoppable trend toward the miniaturization of components. High-speed, mass-production of these electronics is getting more and more difficult because the handling and accurate placement of these tiny components is very challenging. Each component needs to be carefully selected, transferred, and then accurately placed and assembled with interconnects – all at lightning speeds. As conventional industrial equipment fails to deposit ultrafine patterns of die attach material and handle such tiny components at required high rates, this calls for the development of alternative high-throughput assembly technologies. At Holst Centre, we have developed laser-assisted processes enabling high-throughput flip-chip integration of microLEDs. More specifically, we demonstrate the capability of high-throughout printing of die attach materials (solder pastes and conductive glues) at sub-20µm resolution and highly-selective and accurate mass transfer of microLEDs at assembly precision of 1µm (lateral) and 1° (rotation) and >99.9% yield.

Laser-Assisted High-throughput microLED Integration

9.00AM

Toppan
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Toppan

9:20AM

Highly bendable oxide TFT withstanding over one million bending cycles

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Manabu Ito

Manabu Ito

In order to realize highly bendable oxide TFT, we have developed a novel organic / inorganic dielectric layer.
Our IGZO TFT with organic/inorganic hybrid dielectric layer can withstand one million bending tests at a bending radius of 1mm without employing the neutral plane concept.
Applications for wearable motion sensors are also demonstrated.

Highly bendable oxide TFT withstanding over one million bending cycles

9:20AM

Raynergy Tek
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Raynergy Tek

9.40AM

New Opportunity for Organic Semiconductors: Applications in Shortwave Infrared Photodetectors

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Yi-Ming Chang

Yi-Ming Chang

The demand for shortwave infrared (SWIR) sensors has shown significant growth in the market. However, the prevailing high costs of existing technology presents a challenge to widespread adoption in consumer electronics. In response, novel technologies have emerged, and among them, organic semiconductors have garnered attention due to their flexible molecular design, large-area coating capability, and devoid of heavy metals. These distinctive attributes position organic semiconductors as promising candidate for SWIR applications. In this presentation, we will summarize an overview of the current status and challenges of utilizing organic semiconductors for SWIR photodetectors from the perspective of a material developer.

New Opportunity for Organic Semiconductors: Applications in Shortwave Infrared Photodetectors

9.40AM

Hummink
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Hummink

10.00AM

The Submicron Printing Breakthrough

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Sahar Al Kamand

Sahar Al Kamand

The future is driven by advancements in microelectronics; however, the design and manufacturing of these intricate components pose significant challenges due to their small dimensions and the complex assembly process involved. Addressing this need, Hummink offers a cutting-edge HPCAP (High-Precision Capillary Printing) technology that allows the direct deposition of materials not only at the micron scale but also at the sub-micron scale. Leveraging Hummink's innovative AFM (Atomic Force Microscopy) based technology, the complex additive manufacturing process for microelectronics is streamlined into a simplified single-step procedure. In this presentation, we will underscore the significance of sub-micron printing in contemporary applications and show its wide-ranging applications in semiconductor packaging, display, biosensors, waveguides, and beyond.

The Submicron Printing Breakthrough

10.00AM

Brilliant Matters
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Brilliant Matters

10.20AM

Materials Developments for Stable, Scalable and Efficient Organic Solar cells

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Philippe Berrouard

Philippe Berrouard

With ever increasing energy needs, rising environmental regulations and a clear paradigm shift in the energy sector towards energy production from renewable sources, there is an immediate need for cost-effective and rapidly deployable renewables. Organic photovoltaics (OPVs) are a 3rd generation solar cell technology which can be mass produced using R2R printing methods and are made from earth abundant organic materials capable of efficiently harvesting light energy both in indoor and outdoor environments. Due to their incredible versatility, they can be made lightweight, flexible and partially transparent, which enables their use in many applications including agrivoltaics (greenhouses), IoT or building-integrated applications. This presentation will discuss some of the latest materials innovations from Brilliant Matters which enable the advancement of OPV technologies.

Materials Developments for Stable, Scalable and Efficient Organic Solar cells

10.20AM

Exhibition Networking Event
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Exhibition Networking Event

10.40AM

Coffee & Exhibition

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Coffee & Exhibition

10.40AM

CEZAMAT, Warsaw University of Tech..
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CEZAMAT, Warsaw University of Tech..

11.30AM

From Hands-On Experience to Calculated Composites: Case Studies of Scaling Up Biomedical Wearables

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Andrzej Pepłowski

Andrzej Pepłowski

After years of extensive research and development in biomedical wearables, focusing on chemical and physical measurements, we have gained significant expertise in their manufacturing. Our extensive knowledge of ink dynamics, colloid mechanics, and material characterization enables us to understand the underlying phenomena in technological processes. Starting from material composition and preparation to printing and device operation, we effectively translate our expertise into scientific advancements. Through quantitative and reproducible methods, we establish the foundation for groundbreaking innovations in printed electronics.

From Hands-On Experience to Calculated Composites: Case Studies of Scaling Up Biomedical Wearables

11.30AM

SunRay Scientific
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SunRay Scientific

11.50AM

A Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Electronics Packaging Applications

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John Yundt

John Yundt

In this work, we propose a novel packaging concept for highly integrated RF systems using SunRay Scientific’s magnetically aligned ZTACH® ACE. We demonstrate the ability to "grow" z-axis interconnects allowing for multilayer packages that are not sensitive to the height between pads. Using this effect, we
introduce two approaches to integrating multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated system-in-a-package. First, a reverse-pyramid package with all chips stacked facing down on a silicon substrate is demonstrated. Second, a "Matryoshka" package assembled with the alternation of chip's face direction is also demonstrated. The simplified assembly process of ZTACH® ACE and the new packaging concepts can offer a compact and cost-effective solution to system-in-package based RF systems. This technology can be processed at temperatures ranging from 80˚C up to 160˚, making it friendly to a range of substrates and applications from PCB, FPC, Flexible Hybrid Electronics and even wearable textile applications where device attach presents considerable issues.

SunRay Scientific will present its success in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for the next level of heterogenous integration. Materials and process development will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements were made for die-to-die bonding and Ball Grid Arrays (BGA) on Polyimide. Test results will show the thin ZTACH® ACE bond, typically 25 – 75 microns thick, provides superior adhesion, low contact resistance, and mechanical robustness on a range of rigid, semi-rigid and flexible substrates during electromechanical testing. Updates on progress towards achieving ≤ 50-micron pitch will be shared.

A Novel, Robust Anisotropic Conductive Epoxy Technology for Advanced Electronics Packaging Applications

11.50AM

X-trodes
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X-trodes

12.10PM

Printed Electrode Arrays: Unleashing the Power of Skin Electrophysiology

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Yael Hanein

Yael Hanein

The utilization of Electroencephalography (EEG) and surface electromyography (sEMG) has long been hindered by their cumbersome nature. Conventional setups involve the use of bulky electrodes, dangling wires, and large amplifier units, limiting their adaptability across various applications. However, advancements in printed electronics and low-power electronics have paved the way for significant simplification of these techniques, leading to the emergence of skin electrophysiology with unprecedented performance. This innovative approach eliminates the necessity of managing multiple electrodes, wires, and amplification units. In this presentation, I will specifically highlight the benefits of our newly developed soft printed electrodes, which have been refined over the years. These electrodes incorporate wireless signal transmission, ensuring stability on the skin and providing user convenience, even during prolonged usage lasting several hours. Additionally, the integration of deep learning and blind source separation methods further enhances system performance, particularly by reducing variability between individuals and sessions.


The presentation will encompass several significant applications and demonstrate how the fusion of electrophysiology and novel skin electrophysiology can bring about remarkable advantages. In the realm of sleep studies, we have validated our system against PSG, the gold standard in medical sleep staging, and showcased its capability to perform sleep staging at home, as well as the detection of REM sleep without atonia (RSWA). Furthermore, the system has been successfully employed in other domains such as high-resolution facial EMG and finger gesture recognition. It has also demonstrated its efficacy in rehabilitation settings, where it enables the acquisition of stable electrophysiological data under natural recording conditions.

Printed Electrode Arrays: Unleashing the Power of Skin Electrophysiology

12.10PM

Rochester Institute of Technology
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Rochester Institute of Technology

12.30PM

Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets

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Denis Cormier

Denis Cormier

Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets

12.30PM

Celanese
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Celanese

12.50PM

Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

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Andree Maindok

Andree Maindok

Silver sintering pastes and films are widely used for attaching SiC dies to their substrates in modern power electronics. They offer mechanical stability to well above the use temperatures (>200C), high thermal conductivity, and do not form brittle inter-metallics. They provide a strong, high reliability bond, especially when sintered with pressure assistance. However, they are not always easy to work with. Developing a product that will sinter at modest temperatures and with modest levels of pressure often results in an unstable formulation that requires cold storage and transport. These products then require conditioning to bring them up to working temperatures before they can be used. If the product cannot be dried before die placement, die size will be limited, or reliability will suffer due to trapped organics left after the sintering process. We have developed several novel paste formulations for sintered silver die, heat sink and top of die attach. They are shelf stable for months at room temperature, offer long open working times with little or no viscosity drift. They can be metal mask stencil printed syringe dispensed, or jetted, and are dried before placement (even when dispensed), allowing large area dies and substrates to be bonded without loss of reliability or thermal performance. We also have new developments in high reliability performance for large area heat sink attachment at reduced temperature and pressure. This allows attachment of encapsulated die/substrate structures onto heat sinks without damage to the organic encapsulant. Extensive reliability test data for these novel formulations will be shared that includes harsh liquid to liquid thermal shock performance.

Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

12.50PM

Lunch & Exhibition
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Lunch & Exhibition

1.10PM

Lunch & Exhibition

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Lunch & Exhibition

1.10PM

CONTAG AG
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CONTAG AG

2.50PM

A versatile toolbox for innovative mechatronic systems in industrial applications

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Hendrik Mohrmann

Hendrik Mohrmann

Coming from prototyping of complex PCBs in automotive, telecommunication, medical and other applications, we developed a versatile toolbox providing customized 3D electronics. The use of stretchable substrates such as polyurethane greatly expands the possibilities of conventional flexible and rigid-flexible boards by allowing conformal changes of the PCB. Meandering layout in combination with a textile reinforced dielectric allows controlled stretchability up to 30% with anisotropic stress compensation. The consequent use of Copper allows high conductivity and complex networks with seamless transitions between different dielectric materials. We can thus produce stretchable hybrid multilayer boards that include the whole world of PCB materials and technologies.

The portfolio is further supplemented by solutions from the field of printed electronics. 3D-MIDs are realized by stereolithographic printing of LDS-prepared UV-curing resin as a fast alternative for injection moulding in prototyping and small series. Integration of antennas, sensors and cables into one mechatronic product facilitates assembly, improves reliability and reduces costs.

A versatile toolbox for innovative mechatronic systems in industrial applications

2.50PM

Cicor Group
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Cicor Group

3.10PM

Printed sensors using aerosol jet technology

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Karl-Heinz Fritz

Karl-Heinz Fritz

Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way.

This presentation will give an overview about different ways to make best use of the capabilities.

Printed sensors using aerosol jet technology

3.10PM

MINT Soldering Solutions
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MINT Soldering Solutions

3.30PM

An innovative method to achieve IPC compliant Inter-Metallic Compounds when soldering on printed electronics

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Aviv Ronen

Aviv Ronen

An innovative method to achieve IPC compliant Inter-Metallic Compounds when soldering on printed electronics

3.30PM

Trackwise Designs
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Trackwise Designs

3.50PM

Length-unlimited multilayer flexible printed circuits

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Philip Johnston

Philip Johnston

Flexible printed circuits (FPCs) are a well-proven interconnect technology at the heart of all modern electronics. Due to historic FPC supply chain size limits, ‘oversize’ interconnect remain delivered via conventional wire harness. The presentation will describe Improved Harness Technology™, a novel method of manufacturing length-unlimited multilayer flexible printed circuits that allows the proven weight- and space-saving benefits of replacing conventional wire harness with FPCs in applications previously excluded by size limitations.

Length-unlimited multilayer flexible printed circuits

3.50PM

Exhibition Networking Event
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Exhibition Networking Event

4.10PM

Coffee & Exhibition Closes

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Coffee & Exhibition Closes

4.10PM

TRACK 3
RMIT University
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RMIT University

Stretchable and flexible electronics reshaped for industry-driven aged-care technologies

9.00AM