ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS
Printed, Hybrid, InMold, and 3D Electronics
9-10 March 2022
Virtual Event Platform
About the Event
Description coming soon
Topics Covered
Printed | Flexible | Additive | Hybrid | 3D | Structural | R2R | InMold | Textiles | Stretchable | Conformal | Wearable | Package Level Electronics | Conductive, Dielectric and Adhesives Inks | LIFT | Inkjet | Advanced Screen Print | Electrohydrodynamic | Aerosol | Nanoimprint | HMI | Smart Skin Patches | Perovskite and Organic Photovoltaics| Flexible Substrates and Barriers | Printed Sensors and Actuators | Printed Displays | Low Temperature Attachment | Heat- and Photo-sintering |
Explore our past & upcoming events on this topic
Leading global speakers include:




























Full Agenda
The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone
Coming Soon

9 March 2022
Toppan
Wednesday
Highly bendable Inorganic TFT Array for Sensor Applications
More Details
1:10pm


Manabu Ito
Manager
Flexible thin film transistors (TFT) attract a lot of attention due to its applicability to foldable smartphones, IoT sensors, and photodetectors. For this application, organic TFT had been regarded as a most promising candidate thanks to its soft nature of the component materials. However, organic TFT suffers from its low mobility, poor stability and immature production process.
In this talk, we would like to introduce our highly bendable IGZO TFT. Without employing the neutral plane concept, the TFT can withstand one million times bending tests at a curvature radius of 1 mm for the first time. After one million times bending tests, any noticeable deterioration in device characteristics are not observed. We see a big potential for the application for flexible sensor devices.
All, Printed Electronics, InMold Electronics, Flexible Displays, Ultrathin IC and TFTs, Advanced Displays
Highly bendable Inorganic TFT Array for Sensor Applications
More Details
1:10pm
Flexible thin film transistors (TFT) attract a lot of attention due to its applicability to foldable smartphones, IoT sensors, and photodetectors. For this application, organic TFT had been regarded as a most promising candidate thanks to its soft nature of the component materials. However, organic TFT suffers from its low mobility, poor stability and immature production process.
In this talk, we would like to introduce our highly bendable IGZO TFT. Without employing the neutral plane concept, the TFT can withstand one million times bending tests at a curvature radius of 1 mm for the first time. After one million times bending tests, any noticeable deterioration in device characteristics are not observed. We see a big potential for the application for flexible sensor devices.

9 March 2022
Sunway Communications
Wednesday
The trend toward miniaturization and functional integration in the electronic industry is unbeaten
More Details
1:33pm


Nouhad Bachnak
Managing Director/Swiss Branch



Functional integration requires more and more interconnects to be realized in smallest space. 3D-MID offers solutions meeting both interconnect and space requirements.
The 3D-MID technology is currently in a phase of transformation; it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 to 10 isnât an improvement, thatâs a giant leap. This leap will allow to use 3D-MID on Chip- and IC-Substrate level for mass production and at lower costs.
The current status and new developments of 3D-MID technology at Sunway Communication will be shown in this presentation"
All, Printed Electronics, 3D Printed Electronics, 3D Electronics, InMold Electronics
The trend toward miniaturization and functional integration in the electronic industry is unbeaten
More Details
1:33pm
Functional integration requires more and more interconnects to be realized in smallest space. 3D-MID offers solutions meeting both interconnect and space requirements.
The 3D-MID technology is currently in a phase of transformation; it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 to 10 isnât an improvement, thatâs a giant leap. This leap will allow to use 3D-MID on Chip- and IC-Substrate level for mass production and at lower costs.
The current status and new developments of 3D-MID technology at Sunway Communication will be shown in this presentation"

9 March 2022
Elephantech
Wednesday
Electronic component fabrication with inkjet additive manufacturing.
More Details
1:56 pm


Masaaki Sugimoto
Co-Founder
Elephantech Inc. is a start-up that manufactures and sells Flex PCB that are manufactured in an environmentally friendly manner by utilizing inkjet printing and copper plating under the mission of âMaking the world sustainable with new manufacturing technologiesâ.
Moving forward, we will work not only on Flex PCB manufacturing but also on printing a wide variety of functions such as 3D wiring formation or sensor production through a method in which digital data is used to layer various materials only on necessary parts.
We will realize a sustainable future by spreading our environmentally friendly technology that has been optimized by digital technologies.
In this presentation, I would like to introduce our newly developed interconnections using nickel nano-ink, show the progress of EMI shield manufacturing technology for electronic components, and present the results of our fine-line fabrication trials combined with laser ablation and optical patterning.
All, Printed Electronics, InMold Electronics, 3D Electronics, InMold
Electronic component fabrication with inkjet additive manufacturing.
More Details
1:56 pm
Elephantech Inc. is a start-up that manufactures and sells Flex PCB that are manufactured in an environmentally friendly manner by utilizing inkjet printing and copper plating under the mission of âMaking the world sustainable with new manufacturing technologiesâ.
Moving forward, we will work not only on Flex PCB manufacturing but also on printing a wide variety of functions such as 3D wiring formation or sensor production through a method in which digital data is used to layer various materials only on necessary parts.
We will realize a sustainable future by spreading our environmentally friendly technology that has been optimized by digital technologies.
In this presentation, I would like to introduce our newly developed interconnections using nickel nano-ink, show the progress of EMI shield manufacturing technology for electronic components, and present the results of our fine-line fabrication trials combined with laser ablation and optical patterning.

9 March 2022
Clayens
Wednesday
Plastronics â a short introduction
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2:19pm


Didier Muller
Responsable R&D
Plastronics is a new branch of the electronics industry, setting the electronic circuitry directly at the surface of plastic parts, or inside its structure.
The different processes of the plastronics (LDS, 2K molding, IME, âŠ) gives possibilities to designers and engineers, depending upon the kind of application: antenna, HMI, lighting, sensors etc.
For customers and users, it permits new experience: surfaces, shapes, and aspects.
After highlighting some key manufacturing processes and their possibilities and limits, this presentation will show potential or existing applications. As a conclusion, we will raise some key challenges and hard points the plastronics is facing, such standardization, recycling, âŠ
All, Printed Electronics, InMold Electronics, 3D Electronics, Sensors
Plastronics â a short introduction
More Details
2:19pm
Plastronics is a new branch of the electronics industry, setting the electronic circuitry directly at the surface of plastic parts, or inside its structure.
The different processes of the plastronics (LDS, 2K molding, IME, âŠ) gives possibilities to designers and engineers, depending upon the kind of application: antenna, HMI, lighting, sensors etc.
For customers and users, it permits new experience: surfaces, shapes, and aspects.
After highlighting some key manufacturing processes and their possibilities and limits, this presentation will show potential or existing applications. As a conclusion, we will raise some key challenges and hard points the plastronics is facing, such standardization, recycling, âŠ

9 March 2022
Sateco XT
Wednesday
Molded elastic sensors: from scale-up to commercialization
More Details
3:12pm


Daniel Haefliger
CEO
While stretchable electronics is most commonly realized by printing, this presentation shows an alternative approach using proven elastomer molding technology. The design and manufacturing of a soft capacitive sensor is shown which can continuously measure both touch and compressive force. It can be shaped three-dimensionally, and is suitable for various applications such as automotive, VR, AR, gaming, robotics, medical technology and general industry.
The sensor is made of silicone. It's footprint and dimensions can be freely designed. This enables an ergonomic design of input devices, prostheses and exoskeletons both on small and large surfaces. Silicone is gentle on the skin, and is chemical and temperature-resistant with regard to food.
Validation of the sensor is performed by durability tests including up to 500,000 load cycle and rough environmental conditions of +85°C and -40°C. Various use cases towards commercial use are under way, of which some can be communicated here. Samples including evaluation electronics are available in a starter kit and enable a quick and uncomplicated start into the new technology for everyone.
All, Printed Elecronics, Stretchable Electronics, 3D Electronics, InMold Electronics
Molded elastic sensors: from scale-up to commercialization
More Details
3:12pm
While stretchable electronics is most commonly realized by printing, this presentation shows an alternative approach using proven elastomer molding technology. The design and manufacturing of a soft capacitive sensor is shown which can continuously measure both touch and compressive force. It can be shaped three-dimensionally, and is suitable for various applications such as automotive, VR, AR, gaming, robotics, medical technology and general industry.
The sensor is made of silicone. It's footprint and dimensions can be freely designed. This enables an ergonomic design of input devices, prostheses and exoskeletons both on small and large surfaces. Silicone is gentle on the skin, and is chemical and temperature-resistant with regard to food.
Validation of the sensor is performed by durability tests including up to 500,000 load cycle and rough environmental conditions of +85°C and -40°C. Various use cases towards commercial use are under way, of which some can be communicated here. Samples including evaluation electronics are available in a starter kit and enable a quick and uncomplicated start into the new technology for everyone.

9 March 2022
Arkema-Piezotech
Wednesday
Printed piezoelectric materials: review of applications from sensing to actuation to energy harvesting.
More Details
3:35pm


Mickaël Pruvost
Marketing & Development Manager
Piezoelectric polymers are the most promising electroactive materials with outstanding properties that can be integrated into a variety of flexible electronic devices. Their multifunctional capabilities, bending ability, ease of processing and chemical stability make them attractive for applications in sensors, actuators and energy harvesting. At Arkema, we synthesize piezoelectric fluoropolymers under the name Piezotech that offer endless possibilities to revolutionize our daily lives and make real advances in the electronics, medical, automotive and smart surfaces industries.
The presentation will provide an overview of Piezotech products and their capabilities with a focus on main applications.
All, Printed Electronics, Stretchable Electronics, Haptics, Sensors
Printed piezoelectric materials: review of applications from sensing to actuation to energy harvesting.
More Details
3:35pm
Piezoelectric polymers are the most promising electroactive materials with outstanding properties that can be integrated into a variety of flexible electronic devices. Their multifunctional capabilities, bending ability, ease of processing and chemical stability make them attractive for applications in sensors, actuators and energy harvesting. At Arkema, we synthesize piezoelectric fluoropolymers under the name Piezotech that offer endless possibilities to revolutionize our daily lives and make real advances in the electronics, medical, automotive and smart surfaces industries.
The presentation will provide an overview of Piezotech products and their capabilities with a focus on main applications.

9 March 2022
Nagase ChemteX
Wednesday
Recent Trends of Conductive Inks for Printed Electronics
More Details
3:58pm

Recent Trends of Conductive Inks for Printed Electronics
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3:58pm

9 March 2022
Coatema
Wednesday
Integrated turnkey R2R line with digital and analog printing
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4:56pm

Integrated turnkey R2R line with digital and analog printing
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4:56pm

9 March 2022
XTPL
Wednesday
Ultraprecise printed viscous silver inks for semiconductor packaging applications
More Details
5:41pm

Ultraprecise printed viscous silver inks for semiconductor packaging applications
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5:41pm

9 March 2022
Agfa
Wednesday
Pushing the performance of silver nanoparticle inks for higher conductivity and lower curing temperature
More Details
6:11pm

Pushing the performance of silver nanoparticle inks for higher conductivity and lower curing temperature
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