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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Additive Electronics in Semiconductor Packaging and PCBs

29-30 March 2023
Virtual Event Platform

About the Event

TechBlick’s event on 29-30 March 2023 focuses on all additive technologies used and/or suited to prototyping and manufacturing of semiconductor packaging - from sub-micro to macro scale - from low-frequency to mmWave - from 2D to 2.5D and 3D.

Additive electronics can not only replace subtractive processes based on cost and green credentials but can also enable truly novel designs, components, and manufacturing processes in semiconductor packaging and PCBs.

In this unique conference - colocated online with TechBlick’s event “Digital & 3D Additive Manufacturing of Electronics, Displays, Photovoltaics, and Beyond” - you will learn about all the key additive electronics technology - both mature and emerging ones and both prototyping and manufacturing ready ones - being developed and/or deployed for various use cases in the semiconductor packaging and PCBs industries

The applications covered are numerous covering EMI shielding, HTCC/LTCC printing, wirebond replacement, solder mask, on-demand PCB production, 2.5-3D circuits, novel component geometries and designs, mmWave and 5G circuits, etching masks, post-production repair, multi-layer interpose development and beyond.

Topics Covered

Themes: Inkjet | Aerosol | Electrohydrodynamic Printing | Advanced Dispensing | 3D Printing | LIFT | Digital Plating | Direct Wire | Robotic Platforms | Ink-Less Printing | Path Planning and Control | Selective Jetting | 3D Printed Electronics | PCB Production | Semiconductor Packaging | EMI Shielding | Microwave and mmWave Devices | Semiconductor Production | Wirebond Replacement | 2.5-3D circuits | On-Demand PCB Prototyping | LDS | MID | Selective Metallization | Multilayer Interposers | HTCC/LTCC, and beyond

In the parallel conference, you will also hear about digital and 3D printing in Lighting, Photovoltaics | Photodetectors | Quantum Dots | QLEDs | OLED-QLED | MicroLEDs | Batteries | and Many More

Explore our past & upcoming events on this topic

Leading global speakers include:

Full Agenda

The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone

Coming Soon
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29 March 2023

TechBlick

Wednesday

Welcome & Introduction

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11.25AM

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Khasha Ghaffarzedeh

CEO

Welcome & Introduction

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11.25AM

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29 March 2023

Syenta

Wednesday

Electrochemical Printing of Multi-Material Electronics.

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11.30AM

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Jekaterina Viktorova

CEO and Co-Founder

Syenta is excited to introduce its patented fabrication method for multi-material 3D printing using electrochemistry for the first time. Our method combines electrochemical with three-dimensional control of electrode positions to culminate in a new process for 2D patterning and 3D printing of metals, semiconducting materials as well as polymers into complex shapes with feature sizes as low as 10 mm. Our method does not rely on nanoparticles and therefore does not need post-treatment and allows for nearly bulk material properties and conductivity of copper up to 82% that of bulk metal.

In this talk we will showcase the capabilities of our method, focusing on speed, resolution, and material quality, as well as some of the printed electronic applications for our printer.

Electrochemical Printing of Multi-Material Electronics.

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11.30AM

Syenta is excited to introduce its patented fabrication method for multi-material 3D printing using electrochemistry for the first time. Our method combines electrochemical with three-dimensional control of electrode positions to culminate in a new process for 2D patterning and 3D printing of metals, semiconducting materials as well as polymers into complex shapes with feature sizes as low as 10 mm. Our method does not rely on nanoparticles and therefore does not need post-treatment and allows for nearly bulk material properties and conductivity of copper up to 82% that of bulk metal.

In this talk we will showcase the capabilities of our method, focusing on speed, resolution, and material quality, as well as some of the printed electronic applications for our printer.

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29 March 2023

FUJI CORPORATION

Wednesday

Digital manufacturing of 3D electronics with low temperature SMT

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11.50AM

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Ryojiro Tominaga

Development Center Engineering Department

Section manager

Additive manufacturing driven by digital 3D data is effective approach to make unique shape electrical device.
It also can contribute to accelerate PoC and minimize the production waste.
In the session, we’ll introduce our process technics to realize full additive digital manufacturing of electronics.
Especially, we will focus on the low temperature SMT.

Digital manufacturing of 3D electronics with low temperature SMT

More Details

11.50AM

Additive manufacturing driven by digital 3D data is effective approach to make unique shape electrical device.
It also can contribute to accelerate PoC and minimize the production waste.
In the session, we’ll introduce our process technics to realize full additive digital manufacturing of electronics.
Especially, we will focus on the low temperature SMT.

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29 March 2023

TCL Corporate Research

Wednesday

The Development of IJP-QLED Display towards its Commercialization

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12.10PM

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Longjia Wu

Materials Development Expert/ Lead R&D Manager

Quantum dots light emitting diodes(QLEDs), have been widely recognized as the most promising next-generation display technology candidate. At current stage, the lifetime issue of QLEDs remains the critical challange towards commercialization, especially for blue devices. For mass-production of QLEDs, other issues need to be addressed including device structure compatible for production and improvement in the Ink-Jet-Printed(IJP) device performances.
To solve these issues, TCL QLED team has made significant progress in the development of high-performance QLED devices.The lifetime performance of QLED devices were able to be competitive with that of OLEDs. We have successfully adopted the top emission device structure, which is compatible for panel mass-production with better current efficiency. Furthermore, the performance gap between spin-coated and IJP devices has been largely resolved, owing to the effort on the optimization of inks, film quality and IJP fabrication flow. Such progress is expected to shed light on the dawn of QLED commercialization.

The Development of IJP-QLED Display towards its Commercialization

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12.10PM

Quantum dots light emitting diodes(QLEDs), have been widely recognized as the most promising next-generation display technology candidate. At current stage, the lifetime issue of QLEDs remains the critical challange towards commercialization, especially for blue devices. For mass-production of QLEDs, other issues need to be addressed including device structure compatible for production and improvement in the Ink-Jet-Printed(IJP) device performances.
To solve these issues, TCL QLED team has made significant progress in the development of high-performance QLED devices.The lifetime performance of QLED devices were able to be competitive with that of OLEDs. We have successfully adopted the top emission device structure, which is compatible for panel mass-production with better current efficiency. Furthermore, the performance gap between spin-coated and IJP devices has been largely resolved, owing to the effort on the optimization of inks, film quality and IJP fabrication flow. Such progress is expected to shed light on the dawn of QLED commercialization.

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29 March 2023

XTPL S.A.

Wednesday

High resolution printing of functional materials for advanced high density 3D interconnections.

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12.30PM

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Łukasz Kosior

Business Development Manager

XTPL is a supplier of micron-scale, additive fabrication technology and conductive materials to solve complex challenges in the advanced electronics industry.
The company’s proprietary solutions enable ultra-precise printing of micron-sized functional features with high resolution. This is possible on planar and non-planar complex substrates, including printing continuous highly conductive interconnections over the steps.
During the presentation we will focus on application in high density interconnections (< 10 µm Line/Space) used in Advanced IC Packaging and Flexible Hybrid Electronics (FHE) as a great alternative to traditional wire bonding approach.

High resolution printing of functional materials for advanced high density 3D interconnections.

More Details

12.30PM

XTPL is a supplier of micron-scale, additive fabrication technology and conductive materials to solve complex challenges in the advanced electronics industry.
The company’s proprietary solutions enable ultra-precise printing of micron-sized functional features with high resolution. This is possible on planar and non-planar complex substrates, including printing continuous highly conductive interconnections over the steps.
During the presentation we will focus on application in high density interconnections (< 10 µm Line/Space) used in Advanced IC Packaging and Flexible Hybrid Electronics (FHE) as a great alternative to traditional wire bonding approach.

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29 March 2023

Meet the Speakers

Wednesday

Meet the Speakers

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12.50PM

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Meet the Speakers

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12.50PM

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29 March 2023

Cicor Group

Wednesday

Embedded components in plastic parts including the subsequent connection using aerosol jet printing.

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1.20PM

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Karl-Heinz Fritz

VP Technology & Development

Embedded components in plastic parts including the subsequent connection using aerosol jet printing.

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1.20PM

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29 March 2023

Fraunhofer ENAS

Wednesday

Robot-guided inkjet printing for the production of printed electronics on arbitrary 3D components

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1.40PM

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Prof. Ralf Zichner

Manager Printed Functionalities

The industrial demand for individualized (quantity 1) functionalization of components and devices is increasing. This is why technological alternatives are emerging in order to outweigh the drawbacks of existing and time-consuming production technologies such as molded interconnect device technology (MID) or selective laser sintering (SLS). Robot-guided inkjet printing is particularly attractive in this regard. From a scientific point of view, printed electronics (sensor systems, heaters, conductors, antennas) on 3D devices and components is a particularly promising surface functionalization and highly sought after by industry. The presentation will include current research results as well as selected application examples and demonstrators.

Robot-guided inkjet printing for the production of printed electronics on arbitrary 3D components

More Details

1.40PM

The industrial demand for individualized (quantity 1) functionalization of components and devices is increasing. This is why technological alternatives are emerging in order to outweigh the drawbacks of existing and time-consuming production technologies such as molded interconnect device technology (MID) or selective laser sintering (SLS). Robot-guided inkjet printing is particularly attractive in this regard. From a scientific point of view, printed electronics (sensor systems, heaters, conductors, antennas) on 3D devices and components is a particularly promising surface functionalization and highly sought after by industry. The presentation will include current research results as well as selected application examples and demonstrators.

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29 March 2023

Quantica

Wednesday

Breaking Barriers in 3D Printing: Jetting Functional, High-Viscosity Materials

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2.00PM

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Ben Hartkopp

Co-Founder

Breaking Barriers in 3D Printing: Jetting Functional, High-Viscosity Materials

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2.00PM

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29 March 2023

HighLine Technology

Wednesday

(TBC) Multi-head ultra-fine dispensing of high-viscosity pastes for PV and other applications

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2.20PM

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Maximilian Pospischil

CTO

(TBC) Multi-head ultra-fine dispensing of high-viscosity pastes for PV and other applications

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2.20PM

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29 March 2023

Break

Wednesday

Break

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2.40PM

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Break

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2.40PM

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29 March 2023

J.A.M.E.S GmbH

Wednesday

Accelerating the development of AME

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3.10PM

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Alexandre Schaefer

Business Development Manager

Additively manufactured electronics (AME) is a very important but currently a small part of additively manufacturing itself. The main questions are: how can we come to a more exponential growth in the AME market within the next years and how can we unlock a higher volume earlier for all of us? I will show what is possible today with this technology and where it can go to. And I will provide a possible solution to accelerate the AME market development.

Accelerating the development of AME

More Details

3.10PM

Additively manufactured electronics (AME) is a very important but currently a small part of additively manufacturing itself. The main questions are: how can we come to a more exponential growth in the AME market within the next years and how can we unlock a higher volume earlier for all of us? I will show what is possible today with this technology and where it can go to. And I will provide a possible solution to accelerate the AME market development.

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29 March 2023

IMTEK - University of Freiburg

Wednesday

StarJet technology - Direct molten metal printing for printed, flexible, and 3D electronics applications

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3.30PM

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Zhe Shu

Group Leader

StarJet technology - Direct molten metal printing for printed, flexible, and 3D electronics applications

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3.30PM

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29 March 2023

Neotech AMT

Wednesday

Real and Emerging Applications of 3D Printed Electronics

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3.50PM

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Martin Hedges

Managing Director

Real and Emerging Applications of 3D Printed Electronics

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3.50PM

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29 March 2023

Essemtec AG

Wednesday

Novel automatic repair of populated PCBs in a cost-effective and adaptive way

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4.10PM

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Irving Rodriguez

Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 µm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. This method uses the advantages of solder jetting and pick and place in one instrument, making it extremely accurate, reliable, and cost-effective. The use of different alloys including low-temperature soldering (LTS) is feasible. The results show that this technique significantly improves the throughput of the repaired devices.

Novel automatic repair of populated PCBs in a cost-effective and adaptive way

More Details

4.10PM

Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 µm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. This method uses the advantages of solder jetting and pick and place in one instrument, making it extremely accurate, reliable, and cost-effective. The use of different alloys including low-temperature soldering (LTS) is feasible. The results show that this technique significantly improves the throughput of the repaired devices.

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29 March 2023

Meet the Speakers & Networking

Wednesday

Meet the Speakers & Networking

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4.30PM

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Meet the Speakers & Networking

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4.30PM

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29 March 2023

Exaddon

Wednesday

Microscale Metal 3d Printing

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5.30PM

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Wabe Koelmans

CTO

Microscale Metal 3d Printing

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5.30PM

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29 March 2023

University of Texas

Wednesday

(TBC) Selective micro-scale sintering for next generation semiconductor bumps

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5.50PM

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Michael Cullinan

Assistant Professor

(TBC) Selective micro-scale sintering for next generation semiconductor bumps

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5.50PM

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29 March 2023

Fraunhofer IKTS

Wednesday

Additively printed hybrid ceramic components for microsystem applications

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6.10PM

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Martin Ihle

Project Manager

Ceramics are one of the more difficult materials to fabricate into complex morphologies and are challenging to employ. Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and microsystem applications. LTCC/HTCC devices are manufactured by applying conductive, dielectric, and resistive metal pastes on each ceramic substrate sheet or tape as needed and then pressed together in a specified sequence, laminating them together. This ceramic sheet of printed metal is then fired or sintered which takes place at temperature below 1000°C for LTCC and above 1000°C for HTCC. The resulting package is a multilayer, three-dimensional design that is considerably more compact than a traditional planar microsystems component.

Additively printed hybrid ceramic components for microsystem applications

More Details

6.10PM

Ceramics are one of the more difficult materials to fabricate into complex morphologies and are challenging to employ. Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and microsystem applications. LTCC/HTCC devices are manufactured by applying conductive, dielectric, and resistive metal pastes on each ceramic substrate sheet or tape as needed and then pressed together in a specified sequence, laminating them together. This ceramic sheet of printed metal is then fired or sintered which takes place at temperature below 1000°C for LTCC and above 1000°C for HTCC. The resulting package is a multilayer, three-dimensional design that is considerably more compact than a traditional planar microsystems component.

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29 March 2023

Fraunhofer IKTS

Wednesday

Additively printed hybrid ceramic components for microsystem applications

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6.10PM

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Prashantkumar Pandey

Researcher | PhD Scholar

Ceramics are one of the more difficult materials to fabricate into complex morphologies and are challenging to employ. Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and microsystem applications. LTCC/HTCC devices are manufactured by applying conductive, dielectric, and resistive metal pastes on each ceramic substrate sheet or tape as needed and then pressed together in a specified sequence, laminating them together. This ceramic sheet of printed metal is then fired or sintered which takes place at temperature below 1000°C for LTCC and above 1000°C for HTCC. The resulting package is a multilayer, three-dimensional design that is considerably more compact than a traditional planar microsystems component.
The multilayer-ceramic technology offers exceptional capabilities for the manufacturing of packages, printed circuit boards, and microsystems. The ceramic multilayer technology (e.g. LTCC/HTCC) even enhances these advantages because of its ability (i) for a complex 3D miniaturization with embedded deformable bodies (cantilever, diaphragms), channels and cavities as well as (ii) for the realization of hybrid components with integrated dielectric, conducting, magnetic, piezoelectric and sensorial materials, being (iii) very robust against environmental stress, and providing (iv) outstanding high-frequency qualities (εR, tan δ) in combination with a very good thermomechanical adaptation to typical semiconductors..
A cost-effective solution for producing small quantities and individualized products economically is to employ digital printing technologies like inkjet or aerosol jet. These printing techniques are maskless and are entirely additive, making them incredibly adaptable. The combination of both printing technologies enables large-area and simultaneously precise structuring of multilayer ceramics on the one hand, and the creation of three-dimensional structures on the other. These deposition techniques together with co-printing and co-firing possibility further enables the integration of further passive components such as resistors, coils and capacitors, which enables complete sensor systems and packaging in a very compact design and fast development time.
A special feature are the dielectric ceramic inks based on LTCC, which replace conventional ceramic green films. This increases the flexibility of the manufacturing process, the geometric degree of freedom and the achievable integration density.

Additively printed hybrid ceramic components for microsystem applications

More Details

6.10PM

Ceramics are one of the more difficult materials to fabricate into complex morphologies and are challenging to employ. Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and microsystem applications. LTCC/HTCC devices are manufactured by applying conductive, dielectric, and resistive metal pastes on each ceramic substrate sheet or tape as needed and then pressed together in a specified sequence, laminating them together. This ceramic sheet of printed metal is then fired or sintered which takes place at temperature below 1000°C for LTCC and above 1000°C for HTCC. The resulting package is a multilayer, three-dimensional design that is considerably more compact than a traditional planar microsystems component.
The multilayer-ceramic technology offers exceptional capabilities for the manufacturing of packages, printed circuit boards, and microsystems. The ceramic multilayer technology (e.g. LTCC/HTCC) even enhances these advantages because of its ability (i) for a complex 3D miniaturization with embedded deformable bodies (cantilever, diaphragms), channels and cavities as well as (ii) for the realization of hybrid components with integrated dielectric, conducting, magnetic, piezoelectric and sensorial materials, being (iii) very robust against environmental stress, and providing (iv) outstanding high-frequency qualities (εR, tan δ) in combination with a very good thermomechanical adaptation to typical semiconductors..
A cost-effective solution for producing small quantities and individualized products economically is to employ digital printing technologies like inkjet or aerosol jet. These printing techniques are maskless and are entirely additive, making them incredibly adaptable. The combination of both printing technologies enables large-area and simultaneously precise structuring of multilayer ceramics on the one hand, and the creation of three-dimensional structures on the other. These deposition techniques together with co-printing and co-firing possibility further enables the integration of further passive components such as resistors, coils and capacitors, which enables complete sensor systems and packaging in a very compact design and fast development time.
A special feature are the dielectric ceramic inks based on LTCC, which replace conventional ceramic green films. This increases the flexibility of the manufacturing process, the geometric degree of freedom and the achievable integration density.

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29 March 2023

Dracula Technologies

Wednesday

Inkjet Printed Flexible and Free Design OPV Modules for Indoor Application

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6.30PM

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Florence Archet

R&D Manager

Inkjet printing is a unique coating and printing technique. Fully digital, it allows to print design with a large variety of shape and dimensions. Drop on Demand technology induces low material waste. Moreover, it presents the advantage to be maskless and contactless allowing to avoid any contamination during the deposition of the thin layers. Thus, it caught the printed electronic community attention and more especially the one of the Organic Photovoltaic (OPV) field. In this context and due to the mechanical flexibility, light weight, aesthetics, absorption tunability and environmental friendliness, OPV have superior application potential over their inorganic and hybrid counterparts. In 2004, V. Shah et al. printed the first OPV active layer by inkjet printing. Although the power conversion efficiency is very low (< 0,1%)1 this is the first proof of concept of the feasibility to use inkjet printing for OPV fabrication. The first efficient active layer printed by inkjet printing is made three years later2 and the first OPV fully printed by inkjet printing is obtained only in 20143,4.
To achieve efficient inkjet printed indoor OPV cells and modules, we show that each OPV layer must be carefully optimized, and several key parameters should be finely tuned. However, inkjet printed devices are often made at laboratory scale with small printers and halogenated solvents. To be competitive at industrial scale, OPV modules should be made in air from green solvents with large scale printhead. Herein we demonstrate the challenge to go from academic lab-scale (spin-coating under inert atmosphere, small cell) to industrial scale (inkjet printing in
air, modules).
To prove the great advantage of inkjet printing as a digital technology allowing freedom of forms and designs, OPV modules with different artistic shapes are demonstrated keeping high performance under indoor conditions and allowing better integration into IoT Products. Reported results confirm that inkjet printing has high potential for the processing of indoor OPV, allowing quick changes in design as well as in materials.

Inkjet Printed Flexible and Free Design OPV Modules for Indoor Application

More Details

6.30PM

Inkjet printing is a unique coating and printing technique. Fully digital, it allows to print design with a large variety of shape and dimensions. Drop on Demand technology induces low material waste. Moreover, it presents the advantage to be maskless and contactless allowing to avoid any contamination during the deposition of the thin layers. Thus, it caught the printed electronic community attention and more especially the one of the Organic Photovoltaic (OPV) field. In this context and due to the mechanical flexibility, light weight, aesthetics, absorption tunability and environmental friendliness, OPV have superior application potential over their inorganic and hybrid counterparts. In 2004, V. Shah et al. printed the first OPV active layer by inkjet printing. Although the power conversion efficiency is very low (< 0,1%)1 this is the first proof of concept of the feasibility to use inkjet printing for OPV fabrication. The first efficient active layer printed by inkjet printing is made three years later2 and the first OPV fully printed by inkjet printing is obtained only in 20143,4.
To achieve efficient inkjet printed indoor OPV cells and modules, we show that each OPV layer must be carefully optimized, and several key parameters should be finely tuned. However, inkjet printed devices are often made at laboratory scale with small printers and halogenated solvents. To be competitive at industrial scale, OPV modules should be made in air from green solvents with large scale printhead. Herein we demonstrate the challenge to go from academic lab-scale (spin-coating under inert atmosphere, small cell) to industrial scale (inkjet printing in
air, modules).
To prove the great advantage of inkjet printing as a digital technology allowing freedom of forms and designs, OPV modules with different artistic shapes are demonstrated keeping high performance under indoor conditions and allowing better integration into IoT Products. Reported results confirm that inkjet printing has high potential for the processing of indoor OPV, allowing quick changes in design as well as in materials.

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29 March 2023

Meet The Speakers

Wednesday

Meet The Speakers

More Details

6.50PM

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