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Syenta is excited to introduce its patented fabrication method for multi-material 3D printing using electrochemistry for the first time. Our method combines electrochemical with three-dimensional control of electrode positions to culminate in a new process for 2D patterning and 3D printing of metals, semiconducting materials as well as polymers into complex shapes with feature sizes as low as 10 mm. Our method does not rely on nanoparticles and therefore does not need post-treatment and allows for nearly bulk material properties and conductivity of copper up to 82% that of bulk metal.

In this talk we will showcase the capabilities of our method, focusing on speed, resolution, and material quality, as well as some of the printed electronic applications for our printer.

Additive manufacturing driven by digital 3D data is effective approach to make unique shape electrical device.
It also can contribute to accelerate PoC and minimize the production waste.
In the session, we’ll introduce our process technics to realize full additive digital manufacturing of electronics.
Especially, we will focus on the low temperature SMT.

Quantum dots light emitting diodes(QLEDs), have been widely recognized as the most promising next-generation display technology candidate. At current stage, the lifetime issue of QLEDs remains the critical challange towards commercialization, especially for blue devices. For mass-production of QLEDs, other issues need to be addressed including device structure compatible for production and improvement in the Ink-Jet-Printed(IJP) device performances.
To solve these issues, TCL QLED team has made significant progress in the development of high-performance QLED devices.The lifetime performance of QLED devices were able to be competitive with that of OLEDs. We have successfully adopted the top emission device structure, which is compatible for panel mass-production with better current efficiency. Furthermore, the performance gap between spin-coated and IJP devices has been largely resolved, owing to the effort on the optimization of inks, film quality and IJP fabrication flow. Such progress is expected to shed light on the dawn of QLED commercialization.

XTPL is a supplier of micron-scale, additive fabrication technology and conductive materials to solve complex challenges in the advanced electronics industry.
The company’s proprietary solutions enable ultra-precise printing of micron-sized functional features with high resolution. This is possible on planar and non-planar complex substrates, including printing continuous highly conductive interconnections over the steps.
During the presentation we will focus on application in high density interconnections (< 10 µm Line/Space) used in Advanced IC Packaging and Flexible Hybrid Electronics (FHE) as a great alternative to traditional wire bonding approach.

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The industrial demand for individualized (quantity 1) functionalization of components and devices is increasing. This is why technological alternatives are emerging in order to outweigh the drawbacks of existing and time-consuming production technologies such as molded interconnect device technology (MID) or selective laser sintering (SLS). Robot-guided inkjet printing is particularly attractive in this regard. From a scientific point of view, printed electronics (sensor systems, heaters, conductors, antennas) on 3D devices and components is a particularly promising surface functionalization and highly sought after by industry. The presentation will include current research results as well as selected application examples and demonstrators.

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Additively manufactured electronics (AME) is a very important but currently a small part of additively manufacturing itself. The main questions are: how can we come to a more exponential growth in the AME market within the next years and how can we unlock a higher volume earlier for all of us? I will show what is possible today with this technology and where it can go to. And I will provide a possible solution to accelerate the AME market development.

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Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 µm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. This method uses the advantages of solder jetting and pick and place in one instrument, making it extremely accurate, reliable, and cost-effective. The use of different alloys including low-temperature soldering (LTS) is feasible. The results show that this technique significantly improves the throughput of the repaired devices.

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Ceramics are one of the more difficult materials to fabricate into complex morphologies and are challenging to employ. Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and microsystem applications. LTCC/HTCC devices are manufactured by applying conductive, dielectric, and resistive metal pastes on each ceramic substrate sheet or tape as needed and then pressed together in a specified sequence, laminating them together. This ceramic sheet of printed metal is then fired or sintered which takes place at temperature below 1000°C for LTCC and above 1000°C for HTCC. The resulting package is a multilayer, three-dimensional design that is considerably more compact than a traditional planar microsystems component.

Ceramics are one of the more difficult materials to fabricate into complex morphologies and are challenging to employ. Low or High Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and microsystem applications. LTCC/HTCC devices are manufactured by applying conductive, dielectric, and resistive metal pastes on each ceramic substrate sheet or tape as needed and then pressed together in a specified sequence, laminating them together. This ceramic sheet of printed metal is then fired or sintered which takes place at temperature below 1000°C for LTCC and above 1000°C for HTCC. The resulting package is a multilayer, three-dimensional design that is considerably more compact than a traditional planar microsystems component.
The multilayer-ceramic technology offers exceptional capabilities for the manufacturing of packages, printed circuit boards, and microsystems. The ceramic multilayer technology (e.g. LTCC/HTCC) even enhances these advantages because of its ability (i) for a complex 3D miniaturization with embedded deformable bodies (cantilever, diaphragms), channels and cavities as well as (ii) for the realization of hybrid components with integrated dielectric, conducting, magnetic, piezoelectric and sensorial materials, being (iii) very robust against environmental stress, and providing (iv) outstanding high-frequency qualities (εR, tan δ) in combination with a very good thermomechanical adaptation to typical semiconductors..
A cost-effective solution for producing small quantities and individualized products economically is to employ digital printing technologies like inkjet or aerosol jet. These printing techniques are maskless and are entirely additive, making them incredibly adaptable. The combination of both printing technologies enables large-area and simultaneously precise structuring of multilayer ceramics on the one hand, and the creation of three-dimensional structures on the other. These deposition techniques together with co-printing and co-firing possibility further enables the integration of further passive components such as resistors, coils and capacitors, which enables complete sensor systems and packaging in a very compact design and fast development time.
A special feature are the dielectric ceramic inks based on LTCC, which replace conventional ceramic green films. This increases the flexibility of the manufacturing process, the geometric degree of freedom and the achievable integration density.