Additive Electronics in Semiconductor Packaging and PCBs
29-30 March 2023
TechBlick’s event on 29-30 March 2023 focuses on all additive technologies used and/or suited to prototyping and manufacturing of semiconductor packaging - from sub-micro to macro scale - from low-frequency to mmWave - from 2D to 2.5D and 3D.
Additive electronics can not only replace subtractive processes based on cost and green credentials but can also enable truly novel designs, components, and manufacturing processes in semiconductor packaging and PCBs.
In this unique conference - colocated online with TechBlick’s event “Digital & 3D Additive Manufacturing of Electronics, Displays, Photovoltaics, and Beyond” - you will learn about all the key additive electronics technology - both mature and emerging ones and both prototyping and manufacturing ready ones - being developed and/or deployed for various use cases in the semiconductor packaging and PCBs industries
The applications covered are numerous covering EMI shielding, HTCC/LTCC printing, wirebond replacement, solder mask, on-demand PCB production, 2.5-3D circuits, novel component geometries and designs, mmWave and 5G circuits, etching masks, post-production repair, multi-layer interpose development and beyond.